PCM Glossary Category: E

Half-etched groove allowing controlled bending.

Chemical solution (e.g., ferric chloride, cupric chloride) used in photochemical etching.

Largest contiguous area exposed to etchant without resist protection.

The speed at which material is removed, dependent on chemistry and temperature.

Ratio of vertical depth to horizontal undercut; a measure of control.

Thickness of material removed during the etching process.

Etched meshes used in electronics.

Electrochemical finishing process for smoother surfaces post-etch.

Secondary coating of etched parts with conductive or protective metals.

Process of depositing metal into molds; sometimes combined with etching.

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