Photochemical Machining FAQs

Photochemical etching is a subtractive manufacturing process. A sheet of metal is coated with a light-sensitive photoresist, exposed to UV light through a patterned phototool, and developed so that selected areas are unprotected. An etchant like ferric chloride dissolves the exposed metal, leaving precise features. The resist is then stripped, producing burr-free, stress-free parts that replicate the CAD pattern.

It achieves tolerances of +/-0.001”(+/-.025mm) in thin foils, and typically +/-10% of the metal thickness. This rivals laser cutting in accuracy while avoiding heat distortion, and is more precise than stamping for fine features.

Standard range: 0.001”–0.040” (25 µm – 1.0 mm). In some cases, partial etching can extend to thicker materials up to 0.080”.

Yes. Double-sided etching uses aligned phototools on both sides of the sheet to create channels, cavities, and through-features with tight registration.

Extremely high detail is possible, including fine meshes, microfluidic channels, logos, and complex geometries. Complexity does not significantly increase cost, unlike stamping or machining.

Etched openings can be as small as 0.004” (100 µm), depending on material thickness. Rule of thumb: minimum feature size ≈ material thickness.

Etched parts retain full tensile strength of the base metal because no mechanical stress or heat is introduced. Stamped parts may show work hardening or micro-fractures at edges.

Etching itself produces flat parts, but these can be bent, formed, welded, plated, or assembled into 3D structures. Half-etching can be used to define precise bend lines.

Aluminum, stainless steels, nickel alloys, and copper alloys can be etched with ferric chloride. Titanium, gold, silver, and other specialty metals can be etched with different chemistries, including Hydroflouric Acid.

Yes. Stainless steel is one of the most commonly etched materials, used for aerospace, medical, and electronics applications.

Yes, though special chemistries may be required. Aluminum is etched for lightweight applications like aerospace and EVs.

Yes. Precious metals are etched for electronics, decorative, and RF shielding applications.

Certain hardened alloys can be etched with the right chemistry. Photochemical etching is not limited to soft metals.

No. PCE works only on metals. Non-metals are not compatible, although metal-coated substrates may be etched.

Parts can be supplied matte, bright, polished, plated, or coated depending on end-use requirements.

Thin foils can hold tolerances as tight as +/-0.001” (+/-.025). As thickness increases, tolerances expand to about +/-10% of material thickness.

Keep minimum feature sizes equal to or greater than the material thickness. Provide adequate spacing between features and account for undercut.

As small as 0.001”–0.002” (25–50 µm), depending on material thickness. Rule of thumb: hole size ≥ +/-110% thickness.

Undercut occurs as etchant removes material laterally under the resist. Designers compensate by adjusting artwork dimensions to meet final specs.

Thicker materials generally increase tolerance range. Thin foils maintain +/-0.001” precision, while thicker sheets are held to +/-10% of thickness.

Yes. Half-etch grooves enable precise bending. Parts can also be plated or integrated into assemblies.

Not accounting for undercut, specifying impossible tolerances, or failing to plan for post-processing needs like forming or plating.

Yes. PCE scales well to production runs of thousands or millions due to low-cost phototools and repeatability.

Cost is much more dependent on material thickness and sheet utilization than complexity. Highly complex parts may cost no more than simple shapes if they fit efficiently on a sheet.

Yes. Tooling is inexpensive, making it cost-effective for prototypes and small batches.

At very high volumes where expensive stamping dies can be amortized, stamping may become cheaper. For low- to mid-volume production, PCE is more economical. It is often preferred to stick with one production method as volumes scale, due to differences between stamped and etched components that could impact the rest of the assembly.

Typically within 15 business days; expedited services are available.

Phototools cost a fraction of stamping dies or EDM electrodes, reducing upfront expenses.

No. Complexity does not drive cost; part count per sheet and material usage are the primary cost drivers.

Phototools are produced digitally and quickly, often same-day, keeping lead times short.

Yes. The same process used for prototypes can be scaled up to thousands of parts without process changes.

Yes. It produces no chips, swarf, or dust, and material utilization is efficient.

Etchants are regenerated and reused whenever possible. Spent chemicals are neutralized and disposed of according to environmental regulations.

Operators use personal protective equipment (PPE), closed-loop systems, and proper ventilation to ensure safety.

No. The process is burr-free and stress-free, unlike mechanical cutting methods.

Yes. PCE produces parts with the cleanliness and precision required for medical devices and aerospace components.

Because it produces lightweight, precise, and burr-free components such as shielding, fuel atomizers, and heat exchangers.

It enables production of stents, surgical instruments, and implantable devices requiring micro-scale precision and burr-free surfaces.

It creates fine conductor patterns, EMI shielding, and lead frames essential for compact, high-density electronics.

Yes. Flow field plates, current collectors, and battery contact parts are common PCE applications in energy storage and hydrogen systems.

It enables precision antennas, filters, and shielding structures required for high-frequency performance.